Research & development - Leuven | More than two weeks ago
Bonding processes with enhanced overlay accuracy and wafer distortion control will enable new integration options to fabricate future logic, memory, RF, photonic, imager, MEMS… devices. You will be responsible to push W2W overlay performance further by looking into wafer activation, cleaning and bonding parameters. Adjusting the bonding process to the incoming wafer state will become essential and bonding reproducibility will have to be assessed and improved. Furthermore, bonding approaches used in layer transfer technologies allow the introduction of backside power delivery networks and even backside source contacts. Controlling and optimizing wafer distortion during bonding is essential for these applications, as overlay requirements are very tight for future technology nodes. Appropriate scanner corrections will mitigate wafer distortion partially, but bonding conditions also need to be adapted to avoid distortions over a short length scale which are difficult to correct during litho exposures.
As a member of the MAterial Transfer (MAT) team, you will be responsible for executing and optimizing W2W bonding processes. Furthermore, you will have to analyse metrology data obtained during bonding (e.g. bond wave) in-depth. You will have to link these bond metrology data with post-bond overlay measurements and propose W2W bonding process adjustments to enhance W2W overlay performance and minimize short range wafer distortions.
To make progress in the field of hybrid bonding, direct interaction across team boundaries (plating, CMP, integration, metrology, litho, cleaning…) will be essential as the bonding result (overlay, bond strength, Cu-to-Cu connectivity) is not only determined by the bonding process itself but also influenced by the state of the wafers. As an R&D process engineer you will work closely together with other researchers to push newly developed processes to a higher maturity level and, in the end, transfer these processes to imec’s pilot line.
As an R&D W2W bonding Engineer you will have a significant number of responsibilities and will therefore be highly influential in helping to achieve the team’s goals and targets.
As an R&D Engineer:
We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.
We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.
We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.