Research & development - Leuven | Just now
Wafer-to-wafer and die-to-wafer bonding are key enablers for three-dimensional integration, including hybrid bonding for fine-pitch Cu–Cu interconnects. During bonding, wafer deformation and the air trapped between the wafers interact through a strongly coupled, time-dependent fluid–structure interaction that can produce non-intuitive bonding dynamics and process sensitivities. A major challenge is meeting extremely tight alignment accuracy requirements, as the process is influenced by many interacting factors (wafer properties, materials, Cu pad topography, chuck design, bonding conditions, forces, adhesion, air effects, gravity). Because experimental optimization alone is slow and costly, there is an increasing need to develop advanced simulation-based methods to better understand and optimize the bonding process.
We are looking for a highly skilled and motivated R&D Thermomechanical Engineer to join our dynamic team. The ideal candidate will have experience in developing thermomechanical models for advanced packaging, which meets the requirements of the semiconductor industry’s new era of chip design.
In this role you will:
We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.
We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.
We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.
IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee-based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes.