/Package Development Engineer (temporary assignment)

Package Development Engineer (temporary assignment)

Engineering - Leuven | More than two weeks ago

to perform package design and analysis (signal and power integrity simulations) - technical discussion with customers and suppliers

Package Design Engineer (temporary assignment)

The Package Design Engineer has to perform package design and analysis (signal and power integrity simulations) and have technical discussions with customers and suppliers

The assignment

  • Select and design the appropriate IC package type based on the given specifications and IC requirements. 
  • Perform a comprehensive analysis of the chosen package's electrical characteristics. Identify any limitations or potential issues that may arise during the design process. 
  • Optimize the electrical performance of the IC package by focusing on signal integrity, power integrity, and electromagnetic compatibility (EMC). Analyze the routing, parasitic effects, and noise issues associated with the package. Propose design modifications or enhancements to improve electrical performance. 
  • Consider manufacturability and cost optimization aspects of the IC package design. Review the design for compatibility with manufacturing processes, assembly requirements, and materials availability. Suggest design modifications to streamline the manufacturing process while maintaining or reducing overall costs. 
  • Produce a comprehensive report summarizing your analysis, design modifications, and optimization recommendations for the IC package. Include detailed diagrams, simulations, calculations, and experimental results where applicable. Clearly communicate the rationale behind your design decisions and their potential impact on the IC's performance and reliability.

Required knowledge and skills

  • Knowledge in Cadence layout tools 
  • Knowledge in Ansys simulation tools 
  • Knowledge in 2.5D/3D packaging, backend silicon layout (place & route)
  • MSc in the field of electronics & equivalent with at least 5 years of experience in packaging design as well as SIPI analysis 
  • Able to communicate in English is a must

What we offer

We offer you an exciting temporary assignment in which you will be part of a community that makes the impossible possible. Together, we shape the technology that will define the society of tomorrow.
  • Duration of the assignment, 1 year, with extension if applicable
  • Desired start date: 01/04/2026
  • Work regime: full time 

Location

We provide the flexibility to work both from our office premises and remotely from home. This to maintain a healthy work-life balance while being an integral part of our team. An onsite presence of 3 days a week is required. It's not possible to work 100% remote. 

---

*Agencies can only present candidates if explicitly invited by Flexforce to our agency portal. Only candidates presented via the agency portal are linked to an agency in our system. Please don't upload candidates via the regular "apply" button as they will not be allocated to your agency in our system and we will not be able to follow up.

Who we are
Accepteer analytics-cookies om deze content te kunnen bekijken.
imec's cleanroom
Accepteer analytics-cookies om deze content te kunnen bekijken.

Explore our other vacancies

Device and Technology Optimization Researcher

As a design-technology co-optimization (DTCO) researcher, you will explore and define the technology for advanced devices at the cell level through process- and layout-aware modeling and benchmarking.

R&D Engineer for thin film depositions

We are looking for an R&D Engineer with a solid background in thin-film vacuum deposition, with a deep understanding of processing techniques such as physical vapor deposition and atomic/molecular layer deposition.

Process step engineer Materials and Interface Laboratory (M&I Lab)

We are seeking a process engineer to provide support for thin film deposition processing & analysis and to enable imec and partner research projects in a unique research environment. The position involves developing intimate knowledge of a laboratory cluster deposition tool to m

Photonics Device Talent Community

Join our photonics talent community in Active, Passive, Packaging & Design Technologies and explore the right fit within one of our photonic device teams!

ASML-imec Collaboration Program Director

As an ‘ASML-imec Collaboration Program Director’, you manage the imec-ASML collaborations in its multiple facets, as a key interface between the ASML technical and product management teams and the imec teams, with a primary focus on CAP program (Collaboration on Angstrom Patterni

Senior Business Development Manager – Aerospace & Security

We are looking for a Senior Business Development Manager to leverage imec world-class nanoelectronics & technologies R&D capabilities to grow our market share in the field of Aerospace & Security and contribute as such to the security and resilience of a safer tomorrow.
Vacatures

Verzend deze job naar jouw e-mailadres