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RF–mmWave IC Design / Packaging Engineer
Research & development - Florida - Kissimmee | More than two weeks ago
Job Title: RF–mmWave IC Design / Packaging Engineer
Location: Kissimmee, FL (imec U.S. R&D Design Center)
Team: Advanced RF
Employment Type: Full-time
About imec
imec is a world-leading research and innovation hub in nanoelectronics and digital technologies. Our U.S. based R&D design center focuses on pioneering advanced RF and superconducting electronics for next-generation applications. We foster a collaborative, hands-on environment where initiative and innovation are encouraged.
About the Role
We are looking for a talented engineer with significant interest and training in millimeter wave (>110 GHz) semiconductor design and packaging to join our multidisciplinary team. You will contribute to active chip design, optimizing interconnects for manufacturability, prototype development, and characterization in advanced RF technologies. This is a critical role to establishing US based capabilities as part of the Florida Semiconductor Engine established by the National Science Foundation.
What You’ll Do
Design active devices in CMOS and III-V (InP).
Optimize for performance and packaging capabilities utilizing Keysight ADS and Ansys HFSS.
Create layouts to tape out chips using Siemens Calibre and Cadence Virtuoso.
Design and optimize passive interconnects to enable heterogeneous integration utilizing imec RF interposer technology.
Design and utilize both virtual and physical measurement platforms for design optimization and verification.
Perform design reviews and create technical documentation and reports.
Work directly with design partners on development and manufacture of prototypes.
Contribute to publications in international journals and conferences.
Minimum Qualifications
Master’s in electrical engineering, physics, or related field.
Strong communication skills for internal and external collaboration.
Successful demonstration of taking a design from concept to prototype measurement.
Experience with semiconductor tapeout.
Experience designing active devices above 110 GHz.
Desired Qualifications
PhD in electrical engineering, physics, or related field.
Experience with Teledyne InP or GlobalFoundries 22FDX+ processes.
Millimeter wave measurements using a manual probe station.
Experience with electronic packaging: wafer bumping, micro-pillars, flip chip bonding, through silicon vias (TSV), or heterogeneous integration.
Location: Kissimmee, FL (imec U.S. R&D Design Center)
Team: Advanced RF
Employment Type: Full-time
About imec
imec is a world-leading research and innovation hub in nanoelectronics and digital technologies. Our U.S. based R&D design center focuses on pioneering advanced RF and superconducting electronics for next-generation applications. We foster a collaborative, hands-on environment where initiative and innovation are encouraged.
About the Role
We are looking for a talented engineer with significant interest and training in millimeter wave (>110 GHz) semiconductor design and packaging to join our multidisciplinary team. You will contribute to active chip design, optimizing interconnects for manufacturability, prototype development, and characterization in advanced RF technologies. This is a critical role to establishing US based capabilities as part of the Florida Semiconductor Engine established by the National Science Foundation.
What You’ll Do
Design active devices in CMOS and III-V (InP).
Optimize for performance and packaging capabilities utilizing Keysight ADS and Ansys HFSS.
Create layouts to tape out chips using Siemens Calibre and Cadence Virtuoso.
Design and optimize passive interconnects to enable heterogeneous integration utilizing imec RF interposer technology.
Design and utilize both virtual and physical measurement platforms for design optimization and verification.
Perform design reviews and create technical documentation and reports.
Work directly with design partners on development and manufacture of prototypes.
Contribute to publications in international journals and conferences.
Minimum Qualifications
Master’s in electrical engineering, physics, or related field.
Strong communication skills for internal and external collaboration.
Successful demonstration of taking a design from concept to prototype measurement.
Experience with semiconductor tapeout.
Experience designing active devices above 110 GHz.
Desired Qualifications
PhD in electrical engineering, physics, or related field.
Experience with Teledyne InP or GlobalFoundries 22FDX+ processes.
Millimeter wave measurements using a manual probe station.
Experience with electronic packaging: wafer bumping, micro-pillars, flip chip bonding, through silicon vias (TSV), or heterogeneous integration.