Engineering - Leuven | More than two weeks ago
As a R&D Engineer Thin Film Adhesion you will be part of a team of material experts working on enabling next generation memories and logic devices. You will work within the Material, Interfaces, Deposition and Analysis (MIDA) department to study material adhesion and reduce the risk of film delamination during FAB processing. Your goal will be to maintain and develop the material adhesion database to become a predictive instrument to prevent delamination events. That includes running test materials, assessing new adhesion measurement technique. In addition, you will take up material development requests on industrial PVD cluster tools in which delamination is an important aspect to manage.
You will:
We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.
We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.
We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.