/R&D Engineer Advanced Patterning Materials

R&D Engineer Advanced Patterning Materials

Engineering - Leuven | More than two weeks ago

You will research and develop advanced patterning materials that will enable the next integration schemes for new generation devices in the field of CMOS and advanced memory.

R&D Engineer Advanced Patterning Materials


To continue the semiconductor industry roadmap, Extreme Ultraviolet (EUV) lithography has emerged as a pivotal technique, facilitating the realization of finer feature sizes essential for the development of cutting-edge logic and memory devices. To keep pushing the boundaries of such technologies by enhancing resolution and precision, High-NA EUV will play an important role in the future. Both EUV and High-NA EUV lithography patterning and etching steps depend on the thin film stack used for pattern transfer into the final layer of interest. This thin film stack needs to be meticulously engineered with the utmost attention to detail, addressing lithographic and etching requirements. The materials constituting this stack must cover a wide range of properties such as film density, roughness, process temperature, and film uniformity, among other critical parameters. These characteristics are integral to satisfying the demands pertaining to critical dimensions (CD), line-edge roughness (LER), line-width roughness (LWR), and defectivity. In light of these considerations, we seek the expertise of an R&D Engineer well-versed in thin film deposition and patterning. The selected candidate will play a pivotal role in supporting and advancing activities related to the engineering and optimization of thin film stacks, thereby contributing to the continual evolution of semiconductor lithography technologies. 

What you will do

You will be a member of the Thin Films Advance Materials and Processes (TFAMP) group within the Materials, Interfaces, Deposition and Analysis (MIDA) department, responsible for the research, development, and characterization of innovative thin films made using state-of-the-art deposition equipment in the 300 mm pilot line. As the designated technical authority, you will assume responsibility for overseeing the deposition processes associated with patterning stacks, encompassing materials such as dielectrics or alloys. Your role will extend to providing technical support for new development requests driven by the integration of EUV and High-NA EUV lithography. Engaging directly in imec's innovative research programs and bilateral R&D projects, you will take ownership of tasks and play a crucial role in ensuring their exceptional execution. Building strong collaborative ties, you will cultivate close relationships with a diverse array of stakeholders, both internal and external customers, as well as equipment and chemical suppliers. This network will enable you to stay abreast of the latest advancements, conducting early assessments of their potential applicability to future High-NA EUV applications. Additionally, you will actively contribute to shaping the strategy and roadmap of the Advanced Patterning Materials team. 

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth. 

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits. 

Who you are

  • You have a Ph.D. degree in Physics, Chemistry, Material Science, or Nanotechnology, or 
  • You have more than 5 years of working experience in the semiconductor industry or in a larger research facility.   
  • You have hands-on experience in operating deposition tools and process development. 
  • You have good knowledge of several deposition techniques such as (PE)ALD and (PE)CVD of dielectrics. 
  • Knowledge of thin film properties and characterization methods is an asset. 
  • You are a real team player and can easily integrate in an international team of professionals. 
  • You have strong organizational skills and show flexibility to change between different projects according to priorities. 
  • You like taking initiative, you are persuasive and assertive, while keeping a constructive attitude. 
  • You have excellent English communication and reporting skills.  
Who we are
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