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/Vacatures/Post doc Electrotomographic imaging using high-density MEA chips (CSC)

Post doc Electrotomographic imaging using high-density MEA chips (CSC)

Research & development - Leuven | More than two weeks ago

Develop novel ways to discriminate tissues using multielectrode array chips.

Post doc Electrotomographic imaging using high-density MEA chips (CSC2021-042)

Project description

Please note that this project is in the framework of Chinese Scholarship Counsel (CSC)-IMEC-KU Leuven Scholarships. Please read the requirements before applying here.

Develop novel ways to discriminate tissues using multielectrode array chips. Electrical tomography based on impedance sensing is a non-invasive medical imaging technique mostly making use of large surface electrodes. It is a powerful technique to discriminate tissues in applications such as skin or breast cancer, or imaging of brain activity. The density of the electrodes is typically low and the scanned area is large. For in situ applications and to detect subtle differences in for example in vitro cellular structures, higher density configurations are needed. Imaging near surfaces of chips such as brain probes could be used for imaging of lesions or tumors. The candidate will explore how to actuate and reconstruct electrical fields by MEA for imaging. Further, this work will look at applying the tissue contrast measurement in relevant application such as brain organoid imaging and tumor discrimination.

 

Promotor: Liesbet Lagae (KU Leuven)

Daily advisor: Tom Torfs (imec)

Manager: Dries Braeken (imec)

Required background: electrical engineer, strong mathematical background

Type of work: 40% modeling, 30% experimental, 30% data analysis

Please note that this project is in the framework of Chinese Scholarship Counsel (CSC)-IMEC-KU Leuven Scholarships. Please read the requirements before applying here.

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