MEMSCAP: MUMPS (Multi-User MEMS) processes

Venue

Abstract

MEMSCAP provides access to three MEMS processes, described below, via the MUMPs MPW service.

The PolyMUMPS process is based upon the deposition of the following layers onto a Si substrate: a nitride isolation layer, a polysilicon ground layer, two structural polysilicon layers, two sacrificial oxide release layers, and one metal layer for electrical connection and enhanced reflectivity.

SOIMUMPs utilises a three mask silcon-on-insulator (SOI) process based upon a starting wafer consisting of layer thicknesses 10 µm, 1 µm, and 400 µm, for the silicon, oxide, and substrate, respectively. The silicon layer may be patterned and etched down to the oxide to form mechanical structures, resistors and electrical routing. In addition, the substrate can be back-etched to the oxide, enabling the construction of through-hole structures.

Metal-MUMPs employs electroplated nickel as the primary structural and interconnect material. In addition to this, doped polysilicon layers may be used to form resistors or further mechanical structures. Electrical isolation is achieved though the deposition of silicon nitride and oxide is employed as a sacrificial layer. Trench layers may be etched into the substrate so as to achieve additional thermal and electrical isolation. Gold plating of the nickel sidewalls may be employed if low contact resistance is desired.

Topics

This training course will provide an introduction to the three MUMPS processes, highlighting their different strengths with reference to potential applications. An overview of the design kits will be presented, and design methodologies will be illustrated using hands-on tutorial exercises. A particular emphasis of the course will be placed on familiarising the participants with the process design rules. In this way, tips and tricks for pushing the process will be discussed.

The format of the course is as follows. The first half of the course will provide attendees with an overview of each of the processes, as well as an introduction to the design kits and design rules. The second half of the course will consist of hands-on design exercises using MEMS Pro from Soft MEMS for design entry andANSYS for finite element modelling.

The PolyMUMPs tutorial sessions will make use of both parameterised and non-parameterised cells from the CaMEL library. Example devices contained withinthis library include: linear comb drives, micro-tongs, and wobble motors. The Metal MUMPS session will employ tutorials based upon relay-like devices, whilst the SOIMUMPs hands-on class will concentrate on optical devices.

Information & registration

Voor meer informatie en registratie, bezoek de volgende web site: http://www.imec.be/tcmwebapp/internet/course.tcm?L=EN_GB&K=MTC&Course=AAAADMV.