Advanced packaging
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Venue
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Location |
IMEC vzw |
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Date |
March 27-28, 2006 |
Abstract
This course will address advanced packaging and assembly technologies. These are strongly driven by the rapid evolution of microelectronics and the increasing complexity of electronic systems. Novel technology trends will be discussed. These have a strong impact on the way electronic systems are designed and manufactured. Electronic packaging is a highly multidisciplinary field, where electrical engineering, mechanical engineering and material science play a key role.
Programme
Programme Chair: Eric Beyne, IMEC vzw
March 27, 2006
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13h00-14h00 |
IC-packaging Demands for increased miniaturisation and performance of electronic systems have driven traditional IC packaging technologies to higher levels of sophistication and miniaturisation. In this session, the different styles of IC packages and their evolution will be discussed, from through-hole to surface mount, from leaded to leadless packages and from 2D to 3D packaging. |
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14h00-15h00 |
Wafer Level Packaging The ultimate miniaturised package has a size equal to the die size. Such packages may be fabricated at the wafer level, before die singulation. This not only results in the smallest possible packages, but also enables cost reduction. All die on a wafer are simultaneously packaged, in contrast to the sequential tradional package flows. This session will focus on technologies such as flip chip bumping, redistribution and wafer-level CSP. Also possibilities for 3D-WLP technologies will be discussed. |
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15h15-16h15 |
Printed circuit board and flexprint technology The latest developments in printed circuit board and flexprint technology will be highlighted. For the rigid board technology the focus will be on sequential build-up and microvia technology, and on embedded components (passive and active). New technologies with very thin flexible circuits and stretchable electronic circuits, including embedded components, will be shown, with emphasis on applications in lightweight, wearable electronic systems. |
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16h15-17h15 |
Board Level Assembly Technology The basics of electronic assembly technology will be explained. The session will focus on soldering being the interconnection methodology most widely used in the electronics industry. It will be oriented to lead-free soldering since this will be the soldering technique of the future. The goal of the session is to provide a basic understanding of the different assembly processes used in industrial level electronic assembly and the related boundary conditions, which become significantly more critical in the lead-free era starting July 1st, 2006. |
March 28, 2006
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09h00-10h30 |
Reliability issues on package and on board level This session starts with an overview of possible packaging-induced IC-failure modes, package failure modes, and interconnect failure modes. This includes both well known failure modes such as 'the pop-corn effect', and less known issues such as 'brittle fracture at low temperatures'. The main failure mechanisms will be explained in more detail. Next several reliability test methods will be described, including testing according to well-known standards, and testing using a failure driven test methodology. Also some techniques that can be used for failure analysis of the packages will be described. |
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10h30-11h00 |
Reliability analysis using simulation methods Simulation methods as virtual prototyping tool will be presented to analyse reliability problems in packaging. Several examples will be shown: wire bonding on Cu/lowK, solder joint interconnection reliability, die and mould cracking during and after processing, mechanical bending of flexible structures, ... |
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11h15-12h15 |
Thermal Management After introducing the main trends in thermal management for IC packages in electronic systems, the basics of thermal heat transport by conduction, convection and radiation will be briefly explained. The session elaborates on the method of using thermal resistance/impedancesfor packages and systems characterisation, assisted by several practical examples. Also an overview of methods for temperature measuring of IC packages will be given. The session ends with an overview of methods for passive/active cooling of electronic systems. |
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13h15-14h15 |
Design-for-Manufacturing: how to make a product out of an
electric schematic An electronic product is a physical entity that must fulfil a multitude of requirements besides performing the functionality that it has been designed for. These requirements are related to its dimensions, weight, appearance, cost, quality, reliability, reparability, environmental impact, ability to recycle, etc. Based on the electronics assembly session the importance of Design-for-Manufacturing (DFM) as a mandatory practice to achieve high quality, reliable electronic products at low manufacturing costs will be explained. Basic Golden Rules for good DFM practice will be presented. Detailed discussion of design rules lies out of the scope of this session. |
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14h15-16h30 |
EMC and signal integrity As bandwidths of signals increase, parasitics and transmission line effects of boards and packages influence significantly the signal quality. At the same time, the passive interconnections become more vulnerable to external interference. Switching noise and ground bounce effect will also play a role in the signal integrity. The concepts of Electromagnetic Compatability and signal integrity will be explained and illustrated. Rules of thumb for good EMC design will be presented. |
Information & registration
For more information and registration, please visit:
http://www.imec.be/tcmwebapp/internet/course.tcm?L=EN_GB&K=MTC&Course=AAAADDP.
Members of the 'Microsystems & Nanotechnology Network' enjoy a
reduction of 25%.