CALL FOR PAPERS

We are honored to announce the ESTC 2012 Conference which is to take place at the RAI Conference and Exhibition Centre of Amsterdam, The Netherlands, 17-20 September 2012. Organized by IEEE-CPMT since 2006, in association with IMAPS-Europe, the Electronics System Integration Technology Conferences (ESTC) conference series is the premier global European event that brings together key researchers, innovators, decision-makers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration in order to present, demonstrate, and discuss the latest developments in assembly and interconnection technology and new innovative applications. Just like its highly successful predecessor events in Dresden (2006), Greenwich (2008) and Berlin (2010), ESTC 2012 will again feature a powerful technical program, as well as professional short courses on various microelectronic packaging technologies. The concurrent exhibition will facilitate the presentation of state-of-the-art technological services and equipment to an interested audience of international decision-makers from science and industry.

MORE INFO - CALL FOR PAPERS

Important Dates:

• Submission deadline for abstracts:	April 1, 2012
• Notification of paper acceptance:	June 1, 2012
• Final paper manuscript due:	August 15, 2012

We look forward to welcoming you to the fourth
IEEE-CPMT Electronics Systems Integration Conference ESTC 2012
in Amsterdam!

Eric Beyne General Chair for ESTC 2012

Ben van der Zon Executive Chair for ESTC 2012

Mervi Paulasto-Kröckel Program Chair for ESTC 2012