Not all research at IMEC can be addressed to a specific research program. This section lists all the IMEC competences and their results.

Full list of competences and results

• Characterization, reliability and modeling
  • Thermal and mechanical modeling
  • Materials and components analysis
  • Modeling and simulation of materials and devices
    • Theoretical and numerical concepts
    • Quantum device modeling
    • First-principles modeling activities
  • Reliability
    • Introduction
    • Gate dielectrics reliability and characterization
    • Electromigration and stress-induced voiding
    • Low-k dielectric reliability
    • Electrostatic discharge protection
    • MEMS reliability
• CMOS device integration
  • CMOS platform process
  • Planar devices
    • Ultra-shallow junctions
    • Silicides
    • Channel engineering
    • Gate dielectric
    • Baseline process
  • Emerging devices
    • Unit process step development for MuGFETs
    • Multi-gate devices (MuGFET)
    • Small circuit demonstrators using multi-gate devices
  • Germanium/III-V devices
    • Ge MOS devices
    • III-V MOS devices
• CMOS options
  • Non-volatile memory
    • Floating-gate devices
    • Nitride-based technology
    • Emerging memory technologies
  • Mixed signal
    • BiCMOS technology
    • 45nm Analog/RF CMOS
• Lithography
  • Immersion lithography extendibility
  • Double-patterning lithography
  • EUV lithography
  • Resist fundamentals
  • CD Metrology
• Pilot lines
  • Silicon pilot line
  • APIC pilot line
  • Solar-cell pilot line
• Nanotechnologies for post-CMOS and new avenues
  • Carbon nanotubes
  • Semiconducting wires
  • Tunnel FETs
  • Plasmonics - metal-based nanophotonics
  • Spintronics and nanomagnetism
  • Functional nanoparticles
  • Neuro-electronics convergence laboratory
• Process steps and modules for CMOS
  • Gate stack
  • Interconnects
    • Cu/low-k interconnects
    • 3D-SIC: stacked ICs
  • Dry etch and post etch residue removal
  • Chemical mechanical polishing
  • Thin-film processing
  • Epitaxial deposition
  • Ultra-clean processing
    • Ultra-clean processing program: cleaning for FEOL applications
    • Ultra-clean processing program: cleaning for BEOL applications
    • Ultra-clean processing program: generic aspects
• Advanced packaging and interconnection technologies
  • RF-integrated passives system-in-a-package technology
    • Above-IC RF technology
    • Multilayer-thin-film
    • Above-IC polySiGe MEMS integration
    • 3D-wireless system integration
  • 3D interconnect and packaging
    • 3D systems in-a-package (SiP)
    • 3D-SIC: stacked Ics
    • 3D-WLP: micro-bumping
    • 3D-WLP: ultra-thin-chip stacking (UTCS)
  • Optical interconnects and sensors
  • RF design and measurements
  • Thermal and mechanical modeling
• Organic technologies
  • Organic electronics
  • Organic memories
  • Organic photovoltaics
• Processes for solar cells
  • Photovoltaic stacks
    • III-V epitaxial layer growth for multijunction solar cells
    • Development of low-bandgap cells for co-generation purposes
  • Organic photovoltaics
  • Solar cells for hydrogen generation
• III-V Technologies
  • III-V MOS devices
  • III-V epitaxial layer growth for multijunction solar cells
  • GaN epitaxial layer growth
  • GaN device processing
  • GaN system integration
  • Solar cells for hydrogen generation
• Bioelectronics
  • Functional nanoparticles
  • Smart implant chip embedding
  • Smart implant encapsulation technology
  • Smart implant ultra-low-power design
  • Neuro-electronics convergence laboratory
• MEMS processes and devices
  • RF-MEMS and RF-MEMS packaging
  • BioMEMS
  • MEMS reliability
  • Micropower generation and storage
  • Above-IC polySiGe MEMS integration
• Analog and RF technologies and systems
  • 3D-wireless system integration
  • Above-IC RF technology
  • Cryogenic sensor systems
  • 3D systems in-a-package (SiP)
  • Design for analog and RF technologies and systems
  • 45nm Analog/RF CMOS
  • Software-defined radio front-end
• Electronics for extreme environments
  • Multilayer-thin-film
  • Above-IC polySiGe MEMS integration
  • 3D-wireless system integration
  • 3D systems in-a-package (SiP)
  • 3D-SIC: stacked ICs
  • Design for analog and RF technologies and systems
  • MEMS reliability
  • GaN device processing
  • Cryogenic sensor systems
• Digital system design technologies for embedded solutions
  • Multi-processor system-on-chip (MPSoC)
  • Power-efficient compiler technology and processor architectures
• Technology-aware design for advanced processing nodes
  • Variability-aware modeling
  • Standardized fine-grained knobs and monitors (SKM)
• Advanced wireless systems
  • RF-CMOS front-ends
  • Next-generation air interfaces
  • Platform solutions for digital baseband
  • Power-efficient mapping of wireless standards
  • Cross-layer solutions for wireless multimedia systems and cognitive radios
  • ADC solutions
  • Analog and RF ICs for CMOS generations beyond 45 nm
• Advanced multimedia systems
  • 3D visual systems
  • Efficient mapping of video codec standards

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