Optical interconnects and sensors
Optical interconnections have proven their performances with the main application being telecommunications over long distances. However, as these optical interconnections gradually migrate towards shorter distances and even inside systems and modules, the range of applications becomes larger and telecommunications may not be the forerunner anymore.
Currently, worldwide interest in using optical interconnections for distances in the range of 1m (e.g. within systems, on boards, in racks) is increasing. The main challenge is to introduce a technology for integrating these optical interconnections which is compatible with the existing technology for manufacturing printed circuit boards (PCBs).
Development of a solution for integrating optical interconnections into PCBs requires experience in the field of optical packaging, fiber handling (incl. termination), optical interconnections and new fabrication technologies such as laser ablation. Each of these disciplines have been a focus of research over the past decade. Once optical interconnections can be integrated into PCBs in an affordable and cost-effective manner, applications such as data-storage, computing, sensing become achievable C15048.
Different materials are already commercially available which exhibit suitable properties in view of compatibility with manufacturing process for PCBs and which also allow the fabrication of low-loss optical waveguides and micro-optical structures C15059, C15049, both by using photolithographic processes or laser-ablation C15058, C15052, the latter being a technique already well established in PCB manufacturing for drilling micro-vias. The laser-ablation, as used within the research group, is a flexible technique and allows the precise manufacturing of micro-optical components, coupling structures and alignment features, all in a single process step P15054.
Starting from basic structures, including optical layers in PCBs, 4 main research themes are being brought forward: fabrication of small-feature waveguides (single-mode applications), multi-layer optical interconnections P15292, P15293, C15055, C15051, C15056, optical interconnections on flexible circuits integrated with embedded optoelectronic components C15053, C15057 and embedding optical fiber sensors into flexible and stretchable substrates.
The introduction of optical interconnections, fiber sensors and optoelectronic components into flexible substrates, follows the recent and obvious trend that can be observed in general PCB manufacturing.
More and more flexible prints take up a significant part of the market share, mainly due to their inherent advantages regarding ease of mounting and assembly, lower weight, reliability, etc.
The technology also opens the way to the development of flexible artificial sensing skins that can be applied on irregular surfaces for a variety of applications.
closeC15053Bosman, E.; Van Steenberge, G.; Geerinck, P.; Christiaens, W.; Vanfleteren, J. and Van Daele, P. Embedding of optical interconnections in flexible electronics. In: 57th Electronic Components and Technology Conference. 2007. pp.1281-1287; (29 May-1 June 2007; Reno, NV, USA.)
closeC15057Bosman, E.; Van Steenberge, G.; Hendrickx, N.; Geerinck, P.; Christiaens, W.; Vanfleteren, J. and Van Daele, P. Multimode optical interconnections embedded in flexible electronics. In: IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference - EMPC. 2007. pp.155-160; (17-20 June 2007; Oulu, Finland.) (ISBN 978-952-99751-1-2 (paper back) or 78-952-99751-2-9 (CD-ROM))
closeP15292Hendrickx, N.; Van Steenberge, G.; Geerinck, P. and Van Daele, P. Laser ablation as enabling technology for the structuring of optical multilayer structures. Journal of Physics: Conference Series. Vol. 59: 118-121; 2007.
closeP15293Hendrickx, N.; Van Erps, J.; Van Steenberge, G.; Thienpont, H. and Van Daele, P. Tolerance analysis for multilayer optical interconnections integrated on a printed circuit board. Journal of Lightwave Technology. Vol. 25: (9) 2395-2401; 2007.
closeC15055Hendrickx, N.; Van Erps, J.; Thienpont, H. and Van Daele, P. Inter-plane coupling structures for PCB-integrated multilayer optical interconnections. In: IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference - EMPC. 2007. pp.65-69; (17-20 June 2007; Oulu, Finland.) (ISBN 978-952-99751-1-2 (paper back) or 78-952-99751-2-9 (CD-ROM))
closeC15051Van Erps, J.; Hendrickx, N.; Debaes, C.; Van Daele, P. and Thienpont, H. Pluggable coupling structures for multilayer board-level optical interconnections. Abstract in: NEMO Scientific General Networking Meeting. 2007. (16-18 May 2007; Florence, Italy.)
closeC15056Van Erps, J.; Hendrickx, N.; Debaes, C.; Van Daele, P. and Thienpont, H. Prototyping of pluggable out-of-plane coupling components for multilayer board-level optical interconnections. In: IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference - EMPC. 2007. pp.70-75; (17-20 June 2007; Oulu, Finland.) (ISBN 978-952-99751-1-2 (paper back) or 78-952-99751-2-9 (CD-ROM))
closeP15054Hendrickx, N.; Van Erps, J.; Van Steenberge, G.; Thienpont, H. and Van Daele, P. Laser ablated micromirrors for printed circuit board integrated optical interconnections. IEEE Photonics Technology Letters. Vol. 19: (11) 822-824; 2007.
closeC15058Hendrickx, N.; Van Erps, J.; Alajoki, T.; Destouches, N.; Blanc, D.; Franc, J.; Karioja, P.; Thienpont, H. and Van Daele, P. Towards low cost coupling structures for short-distance optical interconnections. In: IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference - EMPC. 2007. pp.247-252; (17-20 June 2007; Oulu, Finland.) (ISBN 978-952-99751-1-2 (paper back) or 78-952-99751-2-9 (CD-ROM))
closeC15052Van Steenberge, G.; Hendrickx, N.; Bosman, E.; Van Put, S.; Geerinck, P. and Van Daele, P. Laser ablation: a versatile micro-machining technology. Abstract in: NEMO Scientific General Networking Meeting. (16-18 May 2007; Florence, Italy.)
closeC15059Alajoki, T.; Hendrickx, N.; Van Erps, J.; Obi, S.; Karppinen, M.; Thienpont, H.; Van Daele, P. and Karioja, P. Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board. In: IMAPS Europe Chapter Conference - The 16th European Microelectronics and Packaging Conference - EMPC. 2007. pp.258-261; (17-20 June 2007; Oulu, Finland.)
closeC15049Destouches, N.; Blanc, D.; Franc, J.; Hendrickx, N.; Tonchev, S.; Pommier, J.; Van Daele, P. and Parriaux, O. Efficient resonant grating coupler for short distance optical interconnections. Abstract in: NEMO Scientific General Networking Meeting. 2007. (16-18 May 2007; Florence, Italy.)
closeC15048Van Daele, P. Optical interconnections at the PCB level. Presented at: OIDA Workshop Optical Interconnect. (21-22 February 2007; Santa Clara, CA, USA.)
