About IMEC Annual Report 2007 Scientific report 2007 Collaborate with Imec
Program strategies and related results Full list of competences and results Services and spin off activities Research at associated labs Annexes
IMEC - aspire. invent. achieve.
  • CMOS scaling
    • Strategy
    • Lithography IIAP
      • Advanced lithography
      • Immersion lithography extendibility
      • Double patterning lithography
      • EUV lithography
      • Resist fundamentals
    • Planar IIAP
      • Strategy
      • Ultra-shallow junctions
      • Silicides
      • Channel engineering
      • Gate dielectric
      • Poly electrode
      • Baseline process
    • Emerging alternative devices (EMERALD) IIAP
      • Strategy
      • Unit process step development for MuGFETs
      • Multi-gate devices (MuGFET)
      • Small circuit demonstrators using multi-gate devices
    • Interconnects IIAP
      • Strategy
      • Cu/low-k interconnects
    • 3D IIAP
      • 3D Design
      • 3D-SIC: stacked ICs
      • 3D WLP (through-silicon via technology)
    • Flash memory IIAP
      • Strategy
      • Floating-gate devices
      • Nitride-based technology
    • Ultra-clean processing IIAP
      • Strategy
      • Ultra-clean processing program: cleaning for FEOL applications
      • Ultra-clean processing program: cleaning for BEOL applications
      • Ultra-clean processing program: generic aspects
    • Germanium/III-V IIAP
      • Strategy
      • Ge MOS devices
      • III-V MOS devices
    • Post-CMOS nanotechnology IIAP
      • Strategy
      • Semiconducting wires
      • Tunnel FETs
      • Carbon nanotubes
      • Graphene
  • CMOS-based heterogeneous integration (CMORE)
    • Strategy
    • BiCMOS technology
    • SiGe MEMS
    • MEMS reliability
    • RF-CMOS front-ends
    • Silicon photonics
  • Advanced Packaging and Interconnect Center (APIC)
    • Strategy
    • RF-integrated passives system-in-a-package technology
      • Above-IC RF technology
      • Multilayer-thin-film
      • RF-MEMS and RF-MEMS packaging
      • 3D-wireless system integration
    • 3D interconnect and packaging
      • 3D systems in-a-package (SiP)
      • 3D-SIC: stacked ICs
      • 3D-WLP: micro-bumping
      • 3D-WLP: ultra-thin-chip stacking (UTCS)
    • Advanced chip package solutions
      • Next-generation flip-chip and substrate technology
      • Ultra-thin-chip stack (UTCS) and ultra-thin-chip flex (UTCF)
      • Optical interconnects and sensors
      • Large-area electronics
  • Nomadic Embedded Systems (Apollo)
    • Strategy
    • Software-defined radio front-end
    • Software-defined radio baseband
    • ADC solutions
    • Cognitive radio solutions
    • 60GHz communications
    • Cross-layer (Quality of Experience)
    • Multimedia
    • Multi-processor system-on-chip (MPSoC)
    • Power-efficient compiler technology and processor architectures
    • Technology-aware design (TAD)
  • Photovoltaics (Solar+)
    • Strategy
    • Si-based photovoltaics
    • Photovoltaic stacks
    • Organic photovoltaics
  • GaN and III-V technologies (Power electronics)
    • Strategy
    • GaN epitaxial layer growth
    • GaN device processing
    • GaN system integration
  • Biomedical electronics
    • Strategy
    • Smart implants technology
    • Body area networks
    • Brain-computer interface
    • Molecular imaging, diagnostics and therapy
  • Organic electronics
    • Strategy
    • Organic devices
    • Organic photovoltaics
    • Organic electronics
  • Wireless autonomous transducer solutions (WATS)
    • Strategy
    • Ultra-low-power radio
    • Ultra-low-power DSP
    • Sensors and actuators
    • Micropower generation and storage
    • Human++: body area networks
  • Scientific report 2007
  • Program strategies and related results
  • CMOS scaling
  • Post-CMOS nanotechnology IIAP
Contact: sreport@imec.be
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Post-CMOS nanotechnology IIAP

  • Strategy
  • Semiconducting wires
  • Tunnel FETs
  • Carbon nanotubes
  • Graphene

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